Researchers spend $60M to build wicked fast circuits

The ability to develop high-powered network devices and systems that can see clearly through considerably dense materials or storms are the driving ideas behind nearly $60 million in contracts awarded this week to firms that are building terahertz-speed circuits.

The advanced research scientists at the Defense Advanced Research Projects Agency (DARPA) are behind the project whose goal is to develop what it calls  revolutionary advances in electronic devices and integrated circuits that operate at THz frequencies (at least 1.0 x 10 [to the 12^th power] cycles per second).

DARPA says that THz radiation can transmit through materials we normally think of as opaque: thick smoke, a cloud, fog, dust, or even the sand of a sandstorm. While this neat trick can also be accomplished at some lower frequencies, by millimeter waves for instance, at THz frequencies there is a crucial advantage: we can achieve higher resolution imagery in the THz with order-of-magnitude smaller imaging apertures - making THz imaging systems a practical option for many missions, DARPA said.

Other applications DARPA envisions with THz technology include:

A THz imager could enable a tank traveling through dust and fog to see the vehicle ahead of it.

THz technology could be provided for UAVs, helicopters, humvees-and it could be small enough to provide imaging for dismounted soldiers, some day, even for goggles.

THz imaging could be used at checkpoints-identifying threats at distances of

perhaps 30 meters.

A THz beacon worn by a pilot could be detected if his plane is shot down, allowing a coordinated rescue as long as his general location is known.

DARPA said that the sub-millimeter wave  frequency band between 0.3 to 3 THz has historically been extremely difficult to access due to a lack of effective way to detect, process, and radiate radio-frequency (RF) signals. The range of potential applications associated with this band is nonetheless extensive, including imaging, radar, spectroscopy, and communications. 

DARPA went on to say a significant shortcoming of THz electronics has been the lack of high density integrated circuit technology. For instance, state-of-the-art cascaded frequency multiplier chains typically use single devices that are packaged into large, hand-machined blocks interconnected by waveguides using custom-fabricated transitions.

The size, weight, and cost of such structures prohibit their use in many applications. Achieving the far higher level of integration needed to enable practical THz systems, such as arrays, will require innovative methods for integrating devices into compact circuits. Low-loss interconnects between circuit elements are essential for achieving acceptable performance from these systems. Sub-millimeter wave integrated circuits have recently been demonstrated, but these circuits operate at frequencies well below 1.0THz, DARPA stated.

What's needed is a greatly improved THz transmitter and receiver technologies.   That's where the new contracts with Northrop Grumman Electronic Systems ($8.9 million), SAIC  ($11.6 million) and the Northrop Grumman Space and Mission Systems ($37.3 million) come into play.

Northrop Grumman and SAIC scientists will develop technologies for high-performance electronic circuits that operate at frequencies higher than 1.0 terahertz. The companies are expected to develop  terahertz monolithic integrated circuits; terahertz inter-element interconnects; terahertz circuit integration; terahertz test circuit; and terahertz metrology; and terahertz high power amplifier (HPA) modules, including terahertz power amplifiers DARPA said.

Layer 8 in a box

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• General discussions
• DARPA
• integrated circuits
• network
• radar