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Ultra Wideband gets a boost at Intel show

By , NetworkWorld.com
February 19, 2004 07:37 PM ET

NetworkWorld.com - An emerging wireless technology, called Ultra Wideband, may be getting off the launchpad faster than expected, thanks to several announcements this week at the Intel Developer Forum.

One big UWB industry group has re-organized more formally as a Special Interest Group dedicated to crafting what it hopes will become the industry standard specification for UWB. Meanwhile, the Wireless USB Promoter Group has just been formed and will use that spec as the basis for recasting the widely used Universal Serial Bus (USB) interface, linking PCs and peripherals, as a 480M bits/sec wireless connection.

Finally, one UWB vendor, Staccato Communications, announced it is shipping a wireless USB development kit, a set of components that plug into a PC for software development of wireless USB applications. Staccato also revealed its partnering with NEC to design and build wireless USB chipsets.

Conventional radios send out a single, continuous carrier wave over a specified frequency. By contrast, UWB sends out very short, fast low-power pulses of energy and spreads them over a wide swath of frequencies using well-known modulation techniques such as orthogonal frequency division modulation (OFDM) or direct sequencing. These two different techniques are the basis of two rival UWB proposals being considered by the IEEE. One is by the MultiBand OFDM Alliance and the other is by a group led by Motorola.

The IEEE 802.15.3a Task Group (TG3a) is charged with crafting a high-speed, physical-layer standard for so-called personal-area networks with a range of about 30 feet.

TG3a has been deadlocked over the debate, unable to coalesce enough votes behind the MBOA proposal to move forward with the standard. Unwilling to delay, MBOA members adopted the SIG structure to accelerate their work on what theMy hope will become the de facto UWB standard. The first version of the specification will be published in May. Products are expected in early-to-mid 2005.

"As work progressed, it has become obvious that a more formal structure is needed, simply for issues like intellectual property development, rules and procedures on decision making, etc.," says Mark Fidler, senior engineer scientist with HP's imaging and printing systems group, and an MBOA participant, in an e-email interview.

The SIG's activities won't slow up the process of getting a standard to market, according to Fidler.

"I think it gives a clear path for a specification to be developed, and also a forum for device and silicon producers to come together to express needs, wants, desires, etc.," he wrote. "The MBOA has every intention of of sticking with the current IEEE task group, and the MBOA has also made a commitment to the leaders of the IEEE to bring any relevant specifications back to the IEEE for incorporation into an IEEE specification. I believe, as others do, that this [creation of the SIG] could actually accelerate the process."

That seems to be born out by the newly created Wireless USB Promoter Group, which includes Agere, HP, Intel, Microsoft, NEC and others. The group has already started defining a wireless implementation of the USB 2.0 interconnect, based in part on the work of the MBOA, and on the WiMedia Alliance, which is defining a specification for streaming media over UWB links.

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