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DisruptorBy

Researchers aim for transistors that compute and store in one component

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How to get the most out of your Chromebook

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Data Center Explorer By

Intel targets Nvidia (again) with GPU and cross-processor API

Intel is looking to offer a unified CPU, GPU, and platform architecture that Nvidia doesn’t have but AMD does.

train tracks converge / rails switch / paths merge / convergence / directory traversals

White-box switches yield initial savings but pose challenges

Integrating white-box switches into multi-vendor environments presents management and support issues.

supply chain / virtual network of connections

IoT in 2020: The awkward teenage years

The internet of things will see more growth in 2020, along with more growing pains - security, lack of complete solutions

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Unix as a Second LanguageBy

Red Hat Responds to Zombieload v2

Red Hat calls for updating Linux software to address Intel processor flaws that can lead to data-theft exploits

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Intel unveils new Xeon E-2200 line for entry level servers

The not-so-new line will go where eight cores will do instead of 28 cores.

A complex, complicated cloud.
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DARPA looks for new NICs to speed up networks

The government agency that gave us the Internet 50 years ago is now looking to drastically increase network speed to address bottlenecks and chokepoints for compute-intensive applications. The Defense Advanced Research Projects...

Intel Optane 3D Xpoint DIMM
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Intel announces Optane for workstations, higher capacity NAND

At its Memory and Storage Day 2019 in Seoul last week, Intel made several announcements concerning its Optane persistent storage as well as NAND flash capacity. Optane is a new form of non-volatile memory from Intel that has the...

data center / server racks / connections
Data Center Explorer By

Data center gear will increasingly move off-premises

Cloud and colocation sites will account for half of all data center equipment in just five years, according to 451 Research.

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Data Center Explorer By

Samsung introduces SSDs it claims will 'never die'

Samsung introduced a new generation of SSD memory chips that have fail-in-place technology, which allows the chips to gracefully recover from chip failure.

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Oracle updates Exadata big iron and its cloud commitment

Oracle unveiled the Oracle Exadata X8M, which is designed to accelerate Oracle’s database applications, and announced a massive data center expansion.

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video

How wireless charging works

Wireless charging technology has been around for over 100 years, but it has only recently found mainstream practical use for powering electronic devices like smartphones. Learn how this technology works and what advancements we may...

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Two AMD Epyc processors crush four Intel Xeons in tests

Tests by ServeTheHome found that a server running two AMD Epyc processors can outperform a four-socket Intel system that costs considerably more.

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USB4 gets final approval, offers Ethernet-like speed

USB4 could be a unifying interface that eliminates bulky cables and oversized plugs and provides throughput that satisfies everyone laptop users to server administrators.

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AMD hosts an Epyc party — and everyone wants in

With the release of its second generation of Epyc processors, the Epyc 7002 series, AMD finds it has a lot of new friends -- companies that want to use their technology.

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Xilinx launches new FPGA cards that can match GPU performance

Xilinx unveiled a new FPGA card, the Alveo U50, that it says can match the performance of a GPU in areas of artificial intelligence (AI) and machine learning.

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Apple updates and the company's push toward 5G | TECH(talk)

It's already been a big summer for Apple. At the annual WWDC conference in June, the company unveiled the long-awaited Mac Pro, along with a myriad of software updates. But recent news that Apple may buy Intel's smartphone modem...

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Data Center Explorer By

Server hardware makers shift production out of China

Tariffs on Chinese products and unstable of U.S./China relations cause server hardware makers to move production out of China.

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Data Center Explorer By

Intel unveils new 3D chip packaging design

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections, which is important for server processor technology.

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