Taiwan Semiconductor Manufacturing, the world’s largest contract chip maker, plans to invest in specialty chip packaging company XinTec.
XinTec makes a specialized glass-silicon sandwich package for certain kinds of chips, such as light detection sensors and image sensors used in digital cameras. Chip developers have been turning to more advanced chip packaging techniques to improve chip performance in recent years, enabling them to be smaller and more energy efficient for use in the ever smaller, multifunction devices users demand.
The companies will also share information on chip manufacturing technologies and co-develop new production techniques, XinTec said in a statement.
TSMC said it will pay $41 million for 90.5 million shares of XinTec. The purchase will reportedly raise TSMC’s stake in XinTec to around 51%.
