* HP rolls out data center cooling platform
HP launched a data center cooling system last week that will, according to the company, reduce an organization’s energy costs by 20% to 45%.
The HP Dynamic Smart Cooling system is a software/hardware combination. Software residing in a control node continually adjusts air conditioning settings based on real-time air-temperature measurements gathered from sensors installed on IT racks.
The technology is based on work from HP Labs. HP expects to use the system in its six new data centers.
The company is also launching a partner program to work with engineering, technology and real estate companies to foster the adoption of energy efficient designs for data centers.
HP has also formed a Smart Data Center team within the company that is focused on lowering the cost of ownership of systems through deployment of power and cooling management products. The company has given this team $10 million per year in funding.
Dynamic Smart Cooling works with HP Thermal Logic, a component of the HP BladeSystem c-Class servers. Dynamic Smart Cooling can also be used with any standard IT rack and with standard interfaces to most air conditioning and building management systems.
The company also introduced a 3-Phase Power portfolio, enabling facilities management to deployed power and cooling in a modular fashion. The HP 3-Phase Power portfolio includes a modular three-phase uninterruptible power system (UPS) and 100KVA Power Distribution Rack. When the UPS and Power Distribution Rack are used with HP racks, customers can deploy redundant power grids.
These technologies are the latest of HP’s innovations in power and cooling. They add to HP’s Active Cool Fans, used in BladeSystem servers and the HP Modular Cooling System.
HP Dynamic Smart Cooling and the HP 3-Phase Power portfolio are expected to be available in the third quarter of next year.
