IBM announces success with silicon-on-insulator dynamic memory prototype

IBM last Friday announced it has developed a prototype of the semiconductor industry’s smallest, densest and fastest on-chip dynamic memory device in 32-nanometer, silicon-on-insulator technology that can offer improved speed, power savings and reliability for products ranging from servers to consumer electronics. The new technology offers up to 30% improvement in performance and 40% reduction in power consumption compared to standard bulk silicon technology. The prototype offers 2 -nanosecond latency and access time, an order of 1000 improvement in soft-error rate and a 4-to-1 improvement in reduced standby current.